HAKKO Desoldering wire

Description

HAKKO Desoldering wire

■ Economical and easy-to-use desoldering wire
■ Handy for the removal of solder after dismounting surface-mounted components including BGAs

 FEATURES 

HAKKO WICK
■ Faster thermal transmission for superior performance at lower temperature and with lower wattage soldering irons.
■ Three different
· Regular type: Rosin flux treated copper braid
· Unflux type: Untreated copper braid
· No clean type: Low residue flux treated copper braid
                          Using ESD SAFE package

 Applications 

The ball grid array (BGA) has been removed from the surface of the printed circuit board (PCB).
 
  Trick to remove solder well with the desoldering wire

  Wrong use of the desoldering wire may tear patterns from a PCB or damage discrete components. In order to prevent these problems, make sure to take the preventive measure below:
Apply a bit of solder to the type of solder iron.
Apply a bit of solder to the tip of the desoldering wire. Cut the soldered tip of the wire at an angle of 45 degrees. Solder should remain attached.
Preliminary soldering improves heat conductance

Item No. Part No. Name/Description
224-0453 FR100-01 HAKKO WICK <REGULAR> 1.5MX0.9MM
224-0462 FR100-02 (Discontinued) HAKKO WICK <REGULAR> 1.5MX1.4MM
224-0471 FR100-03 HAKKO WICK <REGULAR> 1.5MX1.9MM
224-0480 FR100-04 (Discontinued) HAKKO WICK <REGULAR> 1.5MX2.5MM
224-0499 FR100-05 HAKKO WICK <REGULAR> 1.5MX3.3MM
Product form

HAKKO Desoldering wire ■ Economical and easy-to-use desoldering wire■ Handy for the removal of solder after dismounting surface-mounted components including BGAs... Read more

$3.10 Excl. VAT

    • Ships within 5–10 business days
    • Ships from South Korea
    • Export packing available
    • Worldwide shipping
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    Description

    HAKKO Desoldering wire

    ■ Economical and easy-to-use desoldering wire
    ■ Handy for the removal of solder after dismounting surface-mounted components including BGAs

     FEATURES 

    HAKKO WICK
    ■ Faster thermal transmission for superior performance at lower temperature and with lower wattage soldering irons.
    ■ Three different
    · Regular type: Rosin flux treated copper braid
    · Unflux type: Untreated copper braid
    · No clean type: Low residue flux treated copper braid
                              Using ESD SAFE package

     Applications 

    The ball grid array (BGA) has been removed from the surface of the printed circuit board (PCB).
     
      Trick to remove solder well with the desoldering wire

      Wrong use of the desoldering wire may tear patterns from a PCB or damage discrete components. In order to prevent these problems, make sure to take the preventive measure below:
    Apply a bit of solder to the type of solder iron.
    Apply a bit of solder to the tip of the desoldering wire. Cut the soldered tip of the wire at an angle of 45 degrees. Solder should remain attached.
    Preliminary soldering improves heat conductance

    Item No. Part No. Name/Description
    224-0453 FR100-01 HAKKO WICK <REGULAR> 1.5MX0.9MM
    224-0462 FR100-02 (Discontinued) HAKKO WICK <REGULAR> 1.5MX1.4MM
    224-0471 FR100-03 HAKKO WICK <REGULAR> 1.5MX1.9MM
    224-0480 FR100-04 (Discontinued) HAKKO WICK <REGULAR> 1.5MX2.5MM
    224-0499 FR100-05 HAKKO WICK <REGULAR> 1.5MX3.3MM

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