HAKKO Desoldering wire

Description

HAKKO Desoldering wire

■ Economical and easy-to-use desoldering wire
■ Handy for the removal of solder after dismounting surface-mounted components including BGAs

 FEATURES 

HAKKO WICK
■ Faster thermal transmission for superior performance at lower temperature and with lower wattage soldering irons.
■ Three different
· Regular type: Rosin flux treated copper braid
· Unflux type: Untreated copper braid
· No clean type: Low residue flux treated copper braid
                          Using ESD SAFE package

 Applications 

The ball grid array (BGA) has been removed from the surface of the printed circuit board (PCB).
 
  Trick to remove solder well with the desoldering wire

  Wrong use of the desoldering wire may tear patterns from a PCB or damage discrete components. In order to prevent these problems, make sure to take the preventive measure below:
Apply a bit of solder to the type of solder iron.
Apply a bit of solder to the tip of the desoldering wire. Cut the soldered tip of the wire at an angle of 45 degrees. Solder should remain attached.
Preliminary soldering improves heat conductance

Item No. Part No. Name/Description
224-0453 FR100-01 HAKKO WICK <REGULAR> 1.5MX0.9MM
224-0462 FR100-02 (Discontinued) HAKKO WICK <REGULAR> 1.5MX1.4MM
224-0471 FR100-03 HAKKO WICK <REGULAR> 1.5MX1.9MM
224-0480 FR100-04 (Discontinued) HAKKO WICK <REGULAR> 1.5MX2.5MM
224-0499 FR100-05 HAKKO WICK <REGULAR> 1.5MX3.3MM
Product form

HAKKO Desoldering wire ■ Economical and easy-to-use desoldering wire■ Handy for the removal of solder after dismounting surface-mounted components including BGAs... Read more

Barcode: 4962615050510

$2.70 Excl. VAT

    • Quick delivery worldwide
    • Satisfied or refunded
    • Secure payments Paypal

      Description

      HAKKO Desoldering wire

      ■ Economical and easy-to-use desoldering wire
      ■ Handy for the removal of solder after dismounting surface-mounted components including BGAs

       FEATURES 

      HAKKO WICK
      ■ Faster thermal transmission for superior performance at lower temperature and with lower wattage soldering irons.
      ■ Three different
      · Regular type: Rosin flux treated copper braid
      · Unflux type: Untreated copper braid
      · No clean type: Low residue flux treated copper braid
                                Using ESD SAFE package

       Applications 

      The ball grid array (BGA) has been removed from the surface of the printed circuit board (PCB).
       
        Trick to remove solder well with the desoldering wire

        Wrong use of the desoldering wire may tear patterns from a PCB or damage discrete components. In order to prevent these problems, make sure to take the preventive measure below:
      Apply a bit of solder to the type of solder iron.
      Apply a bit of solder to the tip of the desoldering wire. Cut the soldered tip of the wire at an angle of 45 degrees. Solder should remain attached.
      Preliminary soldering improves heat conductance

      Item No. Part No. Name/Description
      224-0453 FR100-01 HAKKO WICK <REGULAR> 1.5MX0.9MM
      224-0462 FR100-02 (Discontinued) HAKKO WICK <REGULAR> 1.5MX1.4MM
      224-0471 FR100-03 HAKKO WICK <REGULAR> 1.5MX1.9MM
      224-0480 FR100-04 (Discontinued) HAKKO WICK <REGULAR> 1.5MX2.5MM
      224-0499 FR100-05 HAKKO WICK <REGULAR> 1.5MX3.3MM

      Recently viewed products

      Login

      Forgot your password?

      Don't have an account yet?
      Create account